The conference covers the subject areas including Semiconductor Devices, VLSI Design and Embedded Systems (Track-I), Optics, Photonics, & Biomedical (Track-II), Communication Engineering (Track-III), Signal Processing, Image Processing, Biomedical Signal and Image Processing (Track-IV), Power Electronics (Track-V), Computers in Electronics (Track-VI).

• Semiconductor Devices, VLSI Design and Embedded Systems (Track-I)

  Microelectronic Devices, Circuit & System, Nanoelectronic Devices & Technology, VLSI Design, IC Fabrication and Testing, CMOS VCO, LNA,, Mixer, Trans-receiver, Analog and Digital IC Design, Design for testing, Design for Manufacturing, Real Time Embedded System, VLSI for Signal Processing, Processor and memory design, Networks-on-chip and IoT, Hardware/Software Co-Design & Verification, Embedded Multicores SOC and Systems, Device modeling, simulation, and reliability, RF and Neuromorphic devices and circuits, Sensors, MEMS, and bioelectronics, Packaging and interconnects beyond 2D, AI/ML boosted devices, circuits, and systems, Power and Energy Management at device and circuit level, CAD Tools for VLSI, Optimization of Analog, Digital, & Mixed signal circuits for Various Applications , Circuits for intra-chip communication, EMI & EMC, AI based Robotics & Applications, AI based FPGA Design

• Optics, Photonics, & Biomedical (Track-II)

  Optoelectronic devices, Photodetectors, LEDS and LSER Diodes, Solar cells, Optical Transmitters and Optical Receivers, Material for optics and photonics, Photonic Integrated Circuits, On-chip lasers and Quantum photonics, Waveguides/Multiplexers/Demultiplexers/Interconnects, RF/Mid-IR/THz Photonics, Packaging of Photonic devices, Biomedical Sensors and Wearable Systems, Biorobotics and Biomechanics, Therapeutic & Diagnostic Systems and Technologies, Biomedical Image/Signal, Processing and Imaging, Biomedical Instrumentation and Devices, Sensors, Actuators & Transducers

• Communication Engineering (Track-III)

  Antenna and Wave Propagation, Wireless Sensor Network, Mobile & Wireless, Communication/Networks, Dynamic spectrum sharing, Cognitive Radio & AI, Enabled Networks, Quality of service (QoS), Reliability, & Modeling in Communication, Millimeter wave communications, MIMO and RFID systems, 5G/6G communication, Peer-to-peer and overlay networks, Security and privacy in WiFi, Wireless communication for smart cities, Quantum Communications & Computing, Green Communication Systems & Networks, Adhoc Networks, Pervasive Computing, Satellite Communications & Geo- Satellite, Fibre Optics Communications , ICT Applications

• Signal Processing, Image Processing, Biomedical Signal and Image Processing (Track-IV)

  Signals and Systems, Digital Signal Processing, Multimedia, AR/VR and immersive media, Image & Video Quality Models, Motion Estimation, Registration and Fusion, Detection, Retrieval, Classification Synthesis, Rendering, and Visualization Deep Learning for Images and Videos, Computational Imaging, Compression, Coding, and Transmission, Social media analysis and applications, Audio/Video processing, Detection and estimation theory, Matrix, tensor, and signal separation methods, Data driven methods & Bayesian techniques, Sampling and reconstruction, Signal and system modelling, Adaptive & Distributed signal processing, Optimization techniques and compressive sensing, Quantum & Acoustic signal processing, Intelligent Instrumentation

• Power electronics (Track-V)

  Heavy electronics materials, Discrete and integrated power devices, Devices and circuits for electric vehicles and green energy, Devices/systems for power conversion applications, Power conditioners for automotive, photovoltaic solar, and wind applications, Power devices/systems for electric aviation, smart grid, and wireless power transfer, Power and signal isolators, Power management and control circuits, regulators, and power converter ICs, Energy harvesting circuits and systems, Wide-bandgap topologies and gate-drivers, Power management for automotive systems, battery management circuits and systems

• Computers in Electronics (Track-VI)

  Computing Systems, Computer Networks, High Performance Computer Architecture, Software Development Process, Internet of Things & its applications, Machine Learning & Deep Learning, Cyber Physical System & Security, Fuzzy Logic & Artificial Intelligence, Adhoc Networks, Pervasive Computing, Brain Computer Interface, Data Mining & & Quantum Computing, Information Security, Data Mining & & Quantum Computing, Software Analysis & Testing, Reconfigurable Computing, Reinforcement learning, Cyber-physical systems, High-Performance Computing (HPC), Networking, Storage and Analysis, Computer Vision and pattern recognition, Neural Engineering & Brain Computer Interface, Natural Language Processing, Data Compression , Connected/autonomous vehicles, Optimization Algorithms

• Special Session I: Women in Engineering (Track VII)

  The primary author/presenter of the paper must be a FEMALE. Co-authors/co-presenters can be a MALE or FEMALE.
  All the co-authors must be shown in the initial submission. No further authors can be added for selected papers.
  Papers are invited in the subject areas including but not limited to:
  Semiconductor Devices and circuits, VLSI Design and IC fabrication, Embedded Systems , Opto electronic devices, Photonics, Biomedical instrumentation, Communication Engineering 5G,6G, Satellite communications, Computer networks,Signal Processing, Image Processing, Biomedical Signal and Image Processing, Power Electronics , Artificial intelligence,Neural networks.Quantum computing, natural language processing,Reconfigurable computing.

• Special Session II: Bridging the Digital Divide in the Age of Artificial Intelligence: Leveraging Explainable AI for Social Good (Track VIII)

  The rapid advancement of electronics often prioritises efficiency over equity, threatening to turn technological progress into a tool for social exclusion. Unlike standard technical tracks that focus solely on performance metrics, this session addresses the critical socio-technical barriers—including infrastructure and AI literacy—that prevent marginalised communities from benefiting from Next Generation Electronics.
  By focusing on explainability and inclusivity, this session directly addresses the ethical risks of "black-box" models integrated into modern electronics. Our goal is to shift the narrative from merely accelerating electronic development to democratising AI through transparent design.
  Download Call for Papers
  
  Organizer Name & Contact:
  Dr. B. Prabadevi,
  Associate Professor,
  M.S. Ramaiah University of Applied Sciences, Bangalore, India.
  Email: prabadevib.cs.et@msruas.ac.in
  Call: +919442690043

• Special Session III: Next-Generation Smart Antenna and RF Front-End Technologies for Future Wireless Communication (Track IX)

  The proposed special session is motivated by the growing demand for intelligent, adaptive, and highly integrated RF and antenna technologies to support emerging wireless communication paradigms beyond 5G and toward 6G networks. Unlike conventional sessions focusing solely on antenna design or RF circuits, this session emphasizes the integrated perspective of smart antennas and RF front-end technologies, including reconfigurable architectures, AI/ML-driven optimization, mm Wave and THz systems, and advanced beamforming techniques. The novelty of this session lies in addressing the challenges of system-level integration, spectral efficiency, energy optimization, and compact hardware realization for next-generation electronic platforms. It aims to bridge the gap between theoretical advancements and practical implementation by fostering collaboration between academia and industry. This session will provide insights into emerging research directions and innovative solutions essential for future wireless communication systems.
  Download Call for Papers
  
  Organizer Name & Contact:
  Dr. Rohit Mathur,
  Assistant Professor,
  Vellore Institute of Technology, Vellore, India.
  Email: rohit.mathur@vit.ac.in
  Call: +919929240907

• Special Session IV: Edge-Intelligent and Cloud Connected IoT for Sustainable Societal Applications (Track X)

  The novelty of "Edge-Intelligent and Cloud-Connected IoT for Sustainable Societal Applications" lies in its fusion of edge computing's low-latency processing with cloud scalability, tailored explicitly for equitable, sustainable societal impact unlike traditional IoT sessions that emphasize industrial efficiency alone. By integrating explainable AI to demystify "black-box" models, we pioneer transparent designs that empower marginalized communities, addressing gaps in infrastructure and literacy overlooked by performance-driven tracks.
  
  
  Organizer Name & Contact:
  Dr. M. Vinodhini,
  Assistant Professor,
  Chennai Institute of Technology, Chennai, India.
  Email: vinodhinim.ece@citchennai.net
  Call: +91 8525847143

• Special Session V: Secure and Intelligent Electronics for Next-Generation Connected Systems (Track XI)

  Modern electronic systems are transitioning from isolated embedded platforms to deeply interconnected, intelligent environments operating under strict security and energy constraints. The emergence of post-quantum threats, AI-driven automation, and heterogeneous edge devices necessitates a new generation of electronics that combine computational intelligence with hardware-rooted trust. This session highlights novel research at the intersection of secure VLSI design, lightweight cryptographic hardware, AI acceleration, and resilient communication technologies. Unlike conventional sessions that treat security, intelligence, and hardware separately, this special session emphasizes their co-design to enable adaptive, quantum-aware, and application-specific electronic solutions. The motivation is to bridge theory and deployment by fostering collaboration toward practical, secure electronic infrastructures for future connected systems.
  Download Call for Papers
  
  Organizer Name & Contact:
  Dr. Vijayakumar Perumal,
  Professor,
  Vellore Institute of Technology, Chennai, India.
  Email: vijaya.kumar@vit.ac.in
  Call: +91 9894727271