Authors

Invitation to Participate

We, the proud VITians are happy to announce that the Next Generation Electronics (NeLex-2023), a premier international conference based on electronics will be taking place at Vellore Institute of Technology (VIT, Vellore) from 14th – 16th December, 2023. So we are delighted to invite you and your esteemed colleagues to join us. This conference will be a milestone for academia and industries that are pushing the horizons of electrical, electronics and computer science technology. This is an outstanding opportunity for businesses for the industry to engage with professionals in this field and address their selected market.

This conference will attract wide range of foreign delegates, including professors, students, researchers, entrepreneurs, and eminent technologists to cross paths and exchange the latest as well as newest ideas. It is expected more than 400 delegates visiting Vellore from all over the world. This brochure will provide you with all the information you require. However, if you wish to discuss further, we will be happy to welcome your valuable suggestions. We look forward to working with you and welcoming you to NEleX-2023 @ VIT, Vellore on December 2023!

TRACKS

The conference covers the subject areas including Semiconductor Devices, VLSI Design and Embedded Systems (Track-I), Optics, Photonics, & Biomedical (Track-II), Communication Engineering (Track-III), Signal Processing, Image Processing, Biomedical Signal and Image Processing (Track-IV), Power Electronics (Track-V), Computers in Electronics (Track-VI).


  • semi Microelectronic Devices, Circuit & System, Nanoelectronic Devices & Technology, VLSI Design, IC Fabrication and Testing, CMOS VCO, LNA,, Mixer, Trans-receiver, Analog and Digital IC Design, Design for testing, Design for Manufacturing, Real Time Embedded System, VLSI for Signal Processing, Processor and memory design, Networks-on-chip and IoT, Hardware/Software Co-Design & Verification, Embedded Multicores SOC and Systems, Device modeling, simulation, and reliability, RF and Neuromorphic devices and circuits, Sensors, MEMS, and bioelectronics, Packaging and interconnects beyond 2D, AI/ML boosted devices, circuits, and systems, Power and Energy Management at device and circuit level, CAD Tools for VLSI, Optimization of Analog, Digital, & Mixed signal circuits for Various Applications , Circuits for intra-chip communication, EMI & EMC, AI based Robotics & Applications, AI based FPGA Design

  • semi Optoelectronic devices, Photodetectors, LEDS and LSER Diodes, Solar cells, Optical Transmitters and Optical Receivers, Material for optics and photonics, Photonic Integrated Circuits, On-chip lasers and Quantum photonics, Waveguides/Multiplexers/Demultiplexers/Interconnects, RF/Mid-IR/THz Photonics, Packaging of Photonic devices, Biomedical Sensors and Wearable Systems, Biorobotics and Biomechanics, Therapeutic & Diagnostic Systems and Technologies, Biomedical Image/Signal, Processing and Imaging, Biomedical Instrumentation and Devices, Sensors, Actuators & Transducers

  • semi Antenna and Wave Propagation, Wireless Sensor Network, Mobile & Wireless, Communication/Networks, Dynamic spectrum sharing, Cognitive Radio & AI, Enabled Networks, Quality of service (QoS), Reliability, & Modeling in Communication, Millimeter wave communications, MIMO and RFID systems, 5G/6G communication, Peer-to-peer and overlay networks, Security and privacy in WiFi, Wireless communication for smart cities, Quantum Communications & Computing, Green Communication Systems & Networks, Adhoc Networks, Pervasive Computing, Satellite Communications & Geo- Satellite, Fibre Optics Communications , ICT Applications

  • semi Signals and Systems, Digital Signal Processing, Multimedia, AR/VR and immersive media, Image & Video Quality Models, Motion Estimation, Registration and Fusion, Detection, Retrieval, Classification Synthesis, Rendering, and Visualization Deep Learning for Images and Videos, Computational Imaging, Compression, Coding, and Transmission, Social media analysis and applications, Audio/Video processing, Detection and estimation theory, Matrix, tensor, and signal separation methods, Data driven methods & Bayesian techniques, Sampling and reconstruction, Signal and system modelling, Adaptive & Distributed signal processing, Optimization techniques and compressive sensing, Quantum & Acoustic signal processing, Intelligent Instrumentation

  • semi Heavy electronics materials, Discrete and integrated power devices, Devices and circuits for electric vehicles and green energy, Devices/systems for power conversion applications, Power conditioners for automotive, photovoltaic solar, and wind applications, Power devices/systems for electric aviation, smart grid, and wireless power transfer, Power and signal isolators, Power management and control circuits, regulators, and power converter ICs, Energy harvesting circuits and systems, Wide-bandgap topologies and gate-drivers, Power management for automotive systems, battery management circuits and systems

  • semi Computing Systems, Computer Networks, High Performance Computer Architecture, Software Development Process, Internet of Things & its applications, Machine Learning & Deep Learning, Cyber Physical System & Security, Fuzzy Logic & Artificial Intelligence, Adhoc Networks, Pervasive Computing, Brain Computer Interface, Data Mining & & Quantum Computing, Information Security, Data Mining & & Quantum Computing, Software Analysis & Testing, Reconfigurable Computing, Reinforcement learning, Cyber-physical systems, High-Performance Computing (HPC), Networking, Storage and Analysis, Computer Vision and pattern recognition, Neural Engineering & Brain Computer Interface, Natural Language Processing, Data Compression , Connected/autonomous vehicles, Optimization Algorithms

  • semi
    The primary author/presenter of the paper must be a FEMALE. Co-authors/co-presenters can be a MALE or FEMALE.
    All the co-authors must be shown in the initial submission. No further authors can be added for selected papers.
    Papers are invited in the subject areas including but not limited to:
    Semiconductor Devices and circuits, VLSI Design and IC fabrication, Embedded Systems , Opto electronic devices, Photonics, Biomedical instrumentation, Communication Engineering 5G,6G, Satellite communications, Computer networks,Signal Processing, Image Processing, Biomedical Signal and Image Processing, Power Electronics , Artificial intelligence,Neural networks.Quantum computing, natural language processing,Reconfigurable computing.

Note: Research topics with allied research areas are also encouraged


Date

Key Dates

Submit Your Paper


Call for Papers Due 31-Oct-23 07-Nov-23
Acceptance/Rejection Notification 31 Oct 23 15-Nov-23
Final Manuscript Submission and Conference Registration Due 15-Nov-23 21-Nov-23

Submission

Submission

An electronic copy of a complete paper of up to 6 pages, in IEEE double column Format, A4 size to be submitted through our conference submission portal: Submit Here


For more details about the template please follow the webpage link given below. Click Here

Publication

Publication

All the full-length papers presented at the conference will be submitted to IEEE Xplore Digital Library (conference record no. 59773) subject to meeting the quality requirement of IEEE.

Sessions

Author Interactive Sessions

Pre-conference Tutorial sessions

Women in Engineering


Panel Discussions with Industry and Academia

Panel Discussions with Strategic Sectors