Thermal Evaporation-cfm-facilities

Thermal Evaporation

The vacuum thermal evaporation deposition technique is one of the simple thin film coating techniques. The equipment has vacuum coating unit Model: 12A4D. The system is capable of producing an ultimate vacuum of 5×10− 6 mbar. The vacuum chamber was pumped with a diffusion pump and a rotary pump combination. The pressure in the vacuum chamber was measured using digital Pirani and Penning gauge combination. In this, only one filament is used at a temperature sufficiently high to evaporate even the less volatile material instantaneously. In this method, very small grains of the evaporant alloys are dropped sequentially into the hot boat which immediately vapourize to form a condensate on a nearby heated substrate, ensuring the stoichiometry of the films. This technique allows an excellent control over various deposition parameters to get good stoichiometric films.

Using this technique, the metal and semiconductors in elementary form or compound form can be prepared as thin films. Generally the materials which have low melting points can be prepared as thin films onto the glass or quartz substrates. Various metals such as indium, tin, zinc, cadmium, aluminum, etc are prepared as thin films and annealed in air to prepared indium oxide, zinc oxide, cadmium oxide, etc. Further the compound materials such CZTS or CIGS were also prepared as thin films for solar cell applications. It can deposit both metals and nonmetals, including aluminium, chrome, gold, indium, and many others. This method of evaporation can be applied to deposit metallic contact layers for thin film devices such as OLEDs, solar cells and thin-film transistors.